Alchip Technologies Introduces New AI 3DIC Design and IP Platform

In a significant advancement for AI chip technology, Alchip Technologies showcased its innovative AI 3DIC chiplet design and IP integration at the TSMC 2023 Taiwan Open Innovation Platform^® Ecosystem Forum on December 13, 2023. This new platform is set to enhance the capabilities and efficiency of next-generation AI systems.

Revolutionary 3DIC Design for AI

During the forum, Alchip presented a paper highlighting the advantages of their AI 3DIC design platform. This platform incorporates 224G interconnects and 3D-APlink, optimizing power and thermal solutions in a unified die and package co-design. The platform's approach offers a sophisticated integration of IP, packaging technology, and the collaborative design process.

Enhanced Computational Power and Efficiency

Alchip's 3DIC technology promises to revolutionize AI performance by stacking compute dies with memory and interconnect dies. By using high-density through-silicon-vias (TSV) and hyper bumps, this design strategy achieves a notable increase in compute transistor density. The goal is to store complex neural networks on the chiplet, reducing reliance on external memory and enabling real-time processing of large datasets, thus minimizing energy consumption and latency for more efficient AI computing.

Trailblazing Integration of Advanced SerDes IP

Alchip's platform also leverages TSMC’s CoWoS^® advanced packaging along with leading SerDes IP integration. The design has been rigorously simulated for signal, power integrity, and thermal management, ensuring a reliable and high-performing system.

As a leader in ASIC and SoC design and production services, Alchip Technologies continues to push the boundaries of AI chip design. By enhancing the computational power and efficiency of AI systems, they pave the way for more robust artificial intelligence applications.

AI, 3DIC, Technology